Connector stability test for small system connectors

Extensive studies on large sample sizes of commercial gold-plated connector systems showed that interface motion is a key element in any test methodology used to evaluate connector stability. This was analyzed in terms of the ability of each connector design to mechanically manage surface films and/or wear debris to maintain metallic asperity contact. It was also determined that the evaluation of stability/reliability should be based on a distribution of contact resistance change limits over the range of 5-100 mΩ. This differs significantly from the more traditional approaches requiring that 100% of values are not to exceed a fixed limit. This approach represents a realistic balance between theory, practical measurement limitations, and practical hardware/field experience. The test methodology has been used for several years with positive results regarding implementation, reproducibility, and the ability to quickly identify marginal connector designs. This methodology should also allow the development of data to relate connector stability to critical design parameters