DocumentCode :
151030
Title :
A temperature dependent simple spice based modeling platform for power IGBT modules
Author :
Sfakianakis, Georgios ; Nawaz, Muhammad ; Chimento, Filippo
Author_Institution :
Dept. of Electr. Eng., Electromech. & Power Electron. group, Eindhoven Univ. of Technol., Eindhoven, Netherlands
fYear :
2014
fDate :
14-18 Sept. 2014
Firstpage :
2873
Lastpage :
2879
Abstract :
This paper deals with the development of a PSpice based temperature dependent modelling platform for the evaluation of silicon based IGBT power modules. The developed device modelling platform is intended to be used for the design and assessment of converter valves/cells for potential high power applications in transmission and distribution networks. An extended version of a previous modelling platform implemented in PSpice is presented here taking into account temperature dependence up to (and even beyond) the specified junction temperature of 125°C of 4.5kV StakPak power modules. A set of device modelling parameters (both for IGBTs and diodes) have first been extracted and verified with static and dynamic comparison of experimental data from 4.5kV and 2.0kA Si based IGBT power modules. An overall fair comparison is achieved with varying set of bus voltages and load currents and at different temperatures.
Keywords :
SPICE; insulated gate bipolar transistors; power semiconductor devices; bus voltages; converter cells; converter valves; current 2 kA; distribution networks; load currents; power IGBT modules; temperature 125 degC; temperature dependent simple Spice based modeling platform; transmission networks; voltage 4.5 kV; Insulated gate bipolar transistors; Integrated circuit modeling; Load modeling; Logic gates; Mathematical model; Multichip modules; Temperature dependence; Device Modeling; IGBTs; Power Semiconductor Modules; Semiconductor Devices; Spice Modeling;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Energy Conversion Congress and Exposition (ECCE), 2014 IEEE
Conference_Location :
Pittsburgh, PA
Type :
conf
DOI :
10.1109/ECCE.2014.6953788
Filename :
6953788
Link To Document :
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