Title :
Sensing power MOSFET junction temperature using gate drive turn-on current transient properties
Author :
He Niu ; Lorenz, Robert D.
Author_Institution :
WEMPEC, Univ. of Wisconsin-Madison, Madison, WI, USA
Abstract :
Junction temperature sensing for high bandwidth power MOSFET junction temperature protection is usually achieved on the power converter´s high power side, by directly monitoring the power switches with additional temperature detectors. This requires special considerations for high voltage, high current, high temperature, and EMI protection. This paper presents a new method applied on the power converter´s low power side (MOSFET gate drive) so that junction temperature sensing can be integrated into MOSFET gate drive. For the purpose of demonstrating MOSFET junction temperature sensing, a push-pull gate drive is applied to a switching current divider circuit. The gate drive turn-on current transient waveform is used for MOSFET junction temperature estimation. A `gate drive-MOSFET´ switching dynamic model is implemented indicating the mechanisms of MOSFET gate drive output dynamics. Modeling includes gatedrive push-pull output, gate drive output parasitics, power MOSFET intrinsic parameters, PCB parasitics, and load parasitics. LTSpice simulation of this model is studied and compared with experimental results.
Keywords :
dividing circuits; driver circuits; power MOSFET; printed circuits; switching convertors; temperature measurement; temperature sensors; EMI protection; LTSpice simulation; MOSFET junction temperature estimation; PCB parasitics; gate drive output parasitics; gate drive turn-on current transient property; gate drive turn-on current transient waveform; load parasitics; power MOSFET intrinsic parameter; power MOSFET junction temperature sensing; power converter low power side MOSFET gate drive; power switch; push-pull gate drive; switching current divider circuit; switching dynamic model; temperature detector; Integrated circuit modeling; Junctions; Logic gates; MOSFET; Semiconductor device modeling; Temperature sensors;
Conference_Titel :
Energy Conversion Congress and Exposition (ECCE), 2014 IEEE
Conference_Location :
Pittsburgh, PA
DOI :
10.1109/ECCE.2014.6953794