Title :
High-density power converters for sub-module photovoltaic power management
Author :
Sangwan, Rahul ; Kesarwani, Kapil ; Stauth, Jason T.
Author_Institution :
Thayer Sch. of Eng., Dartmouth Coll., Hanover, NH, USA
Abstract :
This work presents an overview of distributed submodule power electronics based on resonant and switched-capacitor topologies configured in a ladder architecture. We present a new resonant switched-capacitor topology, termed a `direct conversion´ topology because current flow is always uni-directional in the inductor component. The direct topology can be seen as a resonant version of the more common 3-level buck converter. We discuss some of the relevant theory for the direct topology compared to past work on the `indirect´ resonant switched capacitor architecture. We also present a high-density DC-DC converter that can be used in resonant or switched capacitor modes that is implemented in a 0.18 μm bulk CMOS integrated circuit. The presented topologies implement voltage equalization to mitigate power loss due to mismatch at the sub-module level in PV systems. We provide measurement results of key converter specifications based on laboratory testing and also with real PV setups. To test the chip-scale converter, we used a PV module built up from individual cells on a Lexan laminate to provide custom string lengths of 4-6 individual PV cells.
Keywords :
CMOS integrated circuits; DC-DC power convertors; inductors; integrated circuit testing; ladder networks; laminates; photovoltaic power systems; power system management; resonant power convertors; switched capacitor networks; 3-level buck converter; Lexan laminate; PV system; bulk CMOS integrated circuit; chip-scale converter; direct conversion topology; distributed submodule power electronics; high-density DC-DC converter; high-density power converter; indirect resonant switched capacitor architecture; individual PV cell; ladder architecture; power loss mitigation; size 0.18 mum; submodule photovoltaic power management; unidirectional inductor component; voltage equalization; Capacitors; Inductors; Integrated circuits; Logic gates; Resonant frequency; Switches; Topology;
Conference_Titel :
Energy Conversion Congress and Exposition (ECCE), 2014 IEEE
Conference_Location :
Pittsburgh, PA
DOI :
10.1109/ECCE.2014.6953846