DocumentCode
1511757
Title
Differential Via Modeling Methodology
Author
Simonovich, Lambert ; Bogatin, Eric ; Cao, Yazi
Author_Institution
Lamsim Enterprises Inc., Stittsville, ON, Canada
Volume
1
Issue
5
fYear
2011
fDate
5/1/2011 12:00:00 AM
Firstpage
722
Lastpage
730
Abstract
This paper describes a novel method of modeling the differential via on multilayered printed circuit boards (PCBs) used in high-speed digital designs based on the analytical equations for characteristic impedance and effective dielectric constant. In the absence of measured or electromagnetic simulated data traditionally needed to extract these parameters, this method can quickly and efficiently predict the behavior of the differential via holes on PCBs using a circuit simulator.
Keywords
integrated circuit modelling; permittivity; printed circuit design; analytical equation; characteristic impedance; circuit simulator; dielectric constant; differential via modeling methodology; electromagnetic simulated data; high-speed digital design; multilayered printed circuit board; Capacitance; Dielectric constant; Impedance; Inductance; Integrated circuit modeling; Mathematical model; Resonant frequency; Circuit modeling; circuit simulation; via modeling;
fLanguage
English
Journal_Title
Components, Packaging and Manufacturing Technology, IEEE Transactions on
Publisher
ieee
ISSN
2156-3950
Type
jour
DOI
10.1109/TCPMT.2010.2103313
Filename
5764826
Link To Document