DocumentCode :
1512271
Title :
A 1-V, 10-MHz, 3.5-mW, 1-Mb MTCMOS SRAM: with charge-recycling input/output buffers
Author :
Shibata, Nobutaro ; Morimura, Hiroki ; Watanabe, Mayumi
Author_Institution :
NTT LSI Labs., Kanagawa, Japan
Volume :
34
Issue :
6
fYear :
1999
fDate :
6/1/1999 12:00:00 AM
Firstpage :
866
Lastpage :
877
Abstract :
This paper presents a high-speed and low-power SRAM for portable equipment, which is operated by a single battery cell of around 1 V. Its memory cells are made up of high-threshold-voltage (high-Vth) MOSFETs in order to suppress the power dissipation due to large subthreshold leakage currents. For designing peripheral circuitry, we use SRAM´s special feature that input signals of each logic gate during the standby time can be predicted. Low-Vth MOSFETs are assigned for the critical paths of memory-cell access. The leakage current in each logic gate is reduced by high-Vth MOSFETs, which are cut off during standby. The high-Vth, MOSFET in one logic gate can be shared with another logic gate in order to enlarge effective channel width. To shorten the readout time, a step-down boosted-wordline scheme suitable for current-sense readout and a new half-swing bidirectional double-rail bus are used. The data-writing time is halved by means of a pulse-reset wordline architecture. To reduce the power dissipation, a 32-divided memory array structure is employed with a new redundant address-decoding scheme. Also, data transition detectors and a charge-recycling technique are employed for reducing the power dissipation of data-I/O buffers. A 64-K-words×16-bits SRAM test chip, which was fabricated with a 0.5-μm multithreshold voltage CMOS (MTCMOS) process, has demonstrated a 75-ns address access time at a 1-V power supply. The power dissipation during standby is 1.2 μW, and that at a 10-MHz read operation with the modified checkerboard test pattern is 3.9 mW for 30-pF loads
Keywords :
CMOS memory circuits; SRAM chips; high-speed integrated circuits; leakage currents; low-power electronics; memory architecture; 0.5 micron; 1 V; 1.2 muW; 10 MHz; 3.5 mW; 32-divided memory array structure; 75 ns; MTCMOS SRAM; charge-recycling I/O buffers; current-sense readout; data transition detectors; half-swing bidirectional double-rail bus; high-speed SRAM; high-threshold-voltage MOSFETs; input/output buffers; low threshold voltage MOSFETs; low-power SRAM; multithreshold voltage CMOS process; peripheral circuitry; portable equipment; power dissipation reduction; pulse-reset wordline architecture; redundant address-decoding scheme; single battery cell operation; static RAM; step-down boosted-wordline scheme; subthreshold leakage currents; Batteries; Circuits; Logic design; Logic gates; MOSFETs; Power dissipation; Random access memory; Signal design; Subthreshold current; Testing;
fLanguage :
English
Journal_Title :
Solid-State Circuits, IEEE Journal of
Publisher :
ieee
ISSN :
0018-9200
Type :
jour
DOI :
10.1109/4.766821
Filename :
766821
Link To Document :
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