DocumentCode :
1512946
Title :
LDMOS Technology for RF Power Amplifiers
Author :
Theeuwen, S.J.C.H. ; Qureshi, J.H.
Author_Institution :
NXP Semicond., Nijmegen, Netherlands
Volume :
60
Issue :
6
fYear :
2012
fDate :
6/1/2012 12:00:00 AM
Firstpage :
1755
Lastpage :
1763
Abstract :
We show the status of laterally diffused metal-oxide-semiconductor (LDMOS) technology, which has been the device of choice for RF power applications for more than one decade. LDMOS fulfills the requirements for a wide range of class AB and pulsed applications, such as base station, broadcast, and microwave. We present state-of-the-art RF performance of the LDMOS transistor measured with a load-pull test setup, achieving class-AB drain efficiencies of 70% at 2 GHz for on-wafer and packaged devices. Furthermore, the results for several class-AB and Doherty amplifier implementations constructed with this technology are shown. As an illustration, a three-way Doherty application is demonstrated, which has a 7.5-dB back-off efficiency of 47% at 1.8 GHz with a peak power of 700 W and linearity numbers better than -65 dBc.
Keywords :
MOSFET; UHF power amplifiers; wafer level packaging; Doherty amplifier; LDMOS technology; LDMOS transistor; RF power amplifiers; frequency 1.8 GHz; frequency 2 GHz; laterally diffused metal-oxide-semiconductor; load-pull test setup; on-wafer device; packaged device; Breakdown voltage; Capacitance; Logic gates; Metals; Performance evaluation; Radio frequency; Reliability; MOSFET power amplifiers (PAs); Microwave amplifiers; power amplifiers; semiconductor device fabrication;
fLanguage :
English
Journal_Title :
Microwave Theory and Techniques, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9480
Type :
jour
DOI :
10.1109/TMTT.2012.2193141
Filename :
6197247
Link To Document :
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