• DocumentCode
    1513612
  • Title

    Novel lateral merged double Schottky (LMDS) rectifier: proposal and design

  • Author

    Singh, Y. ; Kumar, M.J.

  • Author_Institution
    Centre for Appl. Res. in Electron., IIT, New Delhi, India
  • Volume
    148
  • Issue
    3
  • fYear
    2001
  • fDate
    6/1/2001 12:00:00 AM
  • Firstpage
    165
  • Lastpage
    170
  • Abstract
    The authors report a new Schottky structure, called the lateral merged double Schottky (LMDS) rectifier, which utilises the trenches filled with a high barrier metal to pinch off a low barrier Schottky contact during the reverse bias. Two-dimensional numerical simulation is used to evaluate and compare the performance of the LMDS rectifier with the conventional Schottky and the recently reported lateral merged PiN Schottky (LMPS) rectifier. The authors show that the proposed device provides an order of magnitude reduction in the reverse leakage current and three times higher reverse breakdown voltage when compared to the conventional Schottky rectifier. A significant feature of the LMDS rectifier is that, in spite of having only Schottky junctions, it gives an extremely sharp breakdown similar to that of a PiN diode. It is demonstrated that for forward current densities up to 400 A/cm2 , the LMDS rectifier can provide twice the current that can be realised using the LMPS rectifier for a given forward voltage drop. Furthermore, it is shown that even up to an operating temperature of 80°C, power losses in the LMDS rectifier are smaller than those found in the LMPS rectifier. The reasons for the improved performance of the LMDS rectifier are analysed, and design tradeoffs between the forward voltage drop and the reverse leakage current are presented
  • Keywords
    Schottky diodes; isolation technology; leakage currents; losses; semiconductor device breakdown; semiconductor device models; semiconductor device reliability; solid-state rectifiers; 0 to 80 degC; 2D numerical simulation; design tradeoffs; forward current densities; forward voltage drop; high barrier metal filled trenches; lateral merged double Schottky rectifier; low barrier Schottky contact; operating temperature; power losses; reverse breakdown voltage; reverse leakage current;
  • fLanguage
    English
  • Journal_Title
    Circuits, Devices and Systems, IEE Proceedings -
  • Publisher
    iet
  • ISSN
    1350-2409
  • Type

    jour

  • DOI
    10.1049/ip-cds:20010249
  • Filename
    936341