• DocumentCode
    1513900
  • Title

    New self-aligned T-gate InGaP/GaAs field-effect transistors grown by LP-MOCVD

  • Author

    Lour, W.-S. ; Chang, W.L. ; Shih, Y.M. ; Liu, W.C.

  • Author_Institution
    Dept. of Electr. Eng., Nat. Taiwan-Ocean Univ., China
  • Volume
    20
  • Issue
    6
  • fYear
    1999
  • fDate
    6/1/1999 12:00:00 AM
  • Firstpage
    304
  • Lastpage
    306
  • Abstract
    This paper reports on self-aligned T-gate InGaP/GaAs FETs using n/sup +//N/sup +///spl delta/(P/sup +/)/n structures. N/sup +/-InGaP//spl delta/(P/sup +/)-InGaP/n-GaAs forms a planar-doped barrier. The inherent ohmic gate of camel-gate FETs together with a highly selective etch between an InGaP and a GaAs layers offers a self-aligned T-shape gate with a reduced effective length. A fabricated device with a reduced gate dimension of 1.5×100 (0.6×100) μm2 obtained from 2×100 (1×100) μm2 gate metal exhibits an extrinsic transconductance, unity-current gain frequency, and unity-power gain frequency of 78 (80) mS/mm, 9 (19.5), and 28 (30) GHz, respectively.
  • Keywords
    III-V semiconductors; MOCVD coatings; field effect transistors; gallium arsenide; gallium compounds; indium compounds; CAMFET; InGaP-GaAs; LP-MOCVD growth; ohmic gate; planar doped barrier; selective etching; self-aligned T-gate InGaP/GaAs field effect transistor; transconductance; unity-current gain frequency; unity-power gain frequency; Electrodes; Energy barrier; Etching; FETs; Fabrication; Frequency; Gallium arsenide; Gold; Heterojunctions; Transconductance;
  • fLanguage
    English
  • Journal_Title
    Electron Device Letters, IEEE
  • Publisher
    ieee
  • ISSN
    0741-3106
  • Type

    jour

  • DOI
    10.1109/55.767106
  • Filename
    767106