• DocumentCode
    1513988
  • Title

    Design and Wafer-Level Fabrication of SMA Wire Microactuators on Silicon

  • Author

    Clausi, Donato ; Gradin, Henrik ; Braun, Stefan ; Peirs, Jan ; Stemme, Göran ; Reynaerts, Dominiek ; Van Der Wijngaart, Wouter

  • Author_Institution
    Dept. of Mech. Eng., Katholieke Univ. Leuven, Leuven, Belgium
  • Volume
    19
  • Issue
    4
  • fYear
    2010
  • Firstpage
    982
  • Lastpage
    991
  • Abstract
    This paper reports on the fabrication of microactuators through wafer-level integration of prestrained shape memory alloy wires to silicon structures. In contrast to previous work, the wires are strained under pure tension, and the cold-state reset is provided by single-crystalline silicon cantilevers. The fabrication is based on standard microelectromechanical systems manufacturing technologies, and it enables an actuation scheme featuring high work densities. A mathematical model is discussed, which provides a useful approximation for practical designs and allows analyzing the actuators performance. Prototypes have been tested, and the influence of constructive variations on the actuator behavior is theoretically and experimentally evaluated. The test results are in close agreement with the calculated values, and they show that the actuators feature displacements that are among the highest reported.
  • Keywords
    cantilevers; microactuators; silicon; wafer-scale integration; SMA wire microactuators; Si; cold-state reset; feature displacements; mathematical model; microactuator fabrication; microelectromechanical system manufacturing technology; practical designs; shape memory alloy wires; silicon structure; single-crystalline silicon cantilevers; wafer-level fabrication; Actuator; NiTi; SU-8; TiNi; adhesive bonding; bias spring; cantilever; microelectromechanical systems (MEMS); reset mechanism; shape memory alloy (SMA); silicon structure; wafer-level integration;
  • fLanguage
    English
  • Journal_Title
    Microelectromechanical Systems, Journal of
  • Publisher
    ieee
  • ISSN
    1057-7157
  • Type

    jour

  • DOI
    10.1109/JMEMS.2010.2049474
  • Filename
    5483194