DocumentCode
1513988
Title
Design and Wafer-Level Fabrication of SMA Wire Microactuators on Silicon
Author
Clausi, Donato ; Gradin, Henrik ; Braun, Stefan ; Peirs, Jan ; Stemme, Göran ; Reynaerts, Dominiek ; Van Der Wijngaart, Wouter
Author_Institution
Dept. of Mech. Eng., Katholieke Univ. Leuven, Leuven, Belgium
Volume
19
Issue
4
fYear
2010
Firstpage
982
Lastpage
991
Abstract
This paper reports on the fabrication of microactuators through wafer-level integration of prestrained shape memory alloy wires to silicon structures. In contrast to previous work, the wires are strained under pure tension, and the cold-state reset is provided by single-crystalline silicon cantilevers. The fabrication is based on standard microelectromechanical systems manufacturing technologies, and it enables an actuation scheme featuring high work densities. A mathematical model is discussed, which provides a useful approximation for practical designs and allows analyzing the actuators performance. Prototypes have been tested, and the influence of constructive variations on the actuator behavior is theoretically and experimentally evaluated. The test results are in close agreement with the calculated values, and they show that the actuators feature displacements that are among the highest reported.
Keywords
cantilevers; microactuators; silicon; wafer-scale integration; SMA wire microactuators; Si; cold-state reset; feature displacements; mathematical model; microactuator fabrication; microelectromechanical system manufacturing technology; practical designs; shape memory alloy wires; silicon structure; single-crystalline silicon cantilevers; wafer-level fabrication; Actuator; NiTi; SU-8; TiNi; adhesive bonding; bias spring; cantilever; microelectromechanical systems (MEMS); reset mechanism; shape memory alloy (SMA); silicon structure; wafer-level integration;
fLanguage
English
Journal_Title
Microelectromechanical Systems, Journal of
Publisher
ieee
ISSN
1057-7157
Type
jour
DOI
10.1109/JMEMS.2010.2049474
Filename
5483194
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