• DocumentCode
    151402
  • Title

    Mission profile translation to capacitor stresses in grid-connected photovoltaic systems

  • Author

    Yongheng Yang ; Ke Ma ; Huai Wang ; Blaabjerg, Frede

  • Author_Institution
    Dept. of Energy Technol., Aalborg Univ., Aalborg, Denmark
  • fYear
    2014
  • fDate
    14-18 Sept. 2014
  • Firstpage
    5479
  • Lastpage
    5486
  • Abstract
    DC capacitors are widely adopted in grid-connected PhotoVoltaic(PV) systems for power stabilization and control decoupling. They have become one of the critical components in grid-connected PV inverters in terms of cost, reliability and volume. The electrical and thermal stresses of the DC capacitors are varying along with the intermittent solar PV energy (i.e. of weather-dependency) and also the grid conditions (e.g. voltage fault transients). This paper serves to translate real-field mission profiles (i.e. solar irradiance and ambient temperature) into voltage, current, and temperature stresses of the DC capacitors under both normal and abnormal grid conditions. As a consequence, this investigation provides new insights into the sizing and reliability prediction of those capacitors with respect to priorart studies. Two study cases on a single-stage PV inverter and a two-stage PV inverter are demonstrated by simulations and experiments. The results have verified the discussions.
  • Keywords
    invertors; photovoltaic power systems; power capacitors; power control; power grids; thermal stresses; DC capacitors; ambient temperature; capacitor stress; electrical stress; grid-connected PV inverters; grid-connected photovoltaic systems; intermittent solar PV energy; mission profile translation; power control decoupling; power stabilization; real-field mission profiles; reliability prediction; solar irradiance; thermal stress; voltage fault transients; Capacitance; Capacitors; Control systems; Inverters; Reliability; Stress; Voltage control;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Energy Conversion Congress and Exposition (ECCE), 2014 IEEE
  • Conference_Location
    Pittsburgh, PA
  • Type

    conf

  • DOI
    10.1109/ECCE.2014.6954152
  • Filename
    6954152