• DocumentCode
    151403
  • Title

    Reliability assessment of power MOSFETs working in avalanche mode based on a thermal strain direct measurement approach

  • Author

    Russo, S. ; Testa, Alfredo ; De Caro, S. ; Panarello, S. ; Patane, S. ; Scimone, T. ; Scelba, G. ; Scarcella, Giuseppe

  • Author_Institution
    STMicroelectron., Catania, Italy
  • fYear
    2014
  • fDate
    14-18 Sept. 2014
  • Firstpage
    5487
  • Lastpage
    5494
  • Abstract
    A strong demand of even more compact and reliable power electronic devices has powered in the last years the development of advanced device design techniques. A key role in these techniques is played by the reliability assessment, a procedure that estimates the expected lifetime of power devices according to given mission profiles. The reliability assessment of a low voltage MOSFET working in avalanche mode is faced in this paper through a new experimental approach based on the Coffin Manson law and a direct measurement of the thermal strain over the Source Aluminum layer. The consistence of the proposed technique is evaluated by comparing obtained estimations of the progressive increment of the on state resistance with estimations carried out from other reliability models and endurance tests results. The described approach can be usefully applied to assess the reliability of MOSFETs in applications typical of the automotive field were power devices are tasked to operate in avalanche mode, such as: brake pump drivers, electromagnetic valve control, direct high-pressure injection, starter-alternator and active suspension systems.
  • Keywords
    power MOSFET; semiconductor device reliability; strain measurement; thermal variables measurement; Coffin Manson law; active suspension system; avalanche mode; brake pump driver; direct high-pressure injection; electromagnetic valve control; endurance testing; low voltage power MOSFET; power electronic device; reliability assessment; source aluminum layer; starter-alternator system; state resistance estimation; thermal strain direct measurement approach; MOSFET; Metals; Reliability; Silicon; Strain; Strain measurement; Temperature measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Energy Conversion Congress and Exposition (ECCE), 2014 IEEE
  • Conference_Location
    Pittsburgh, PA
  • Type

    conf

  • DOI
    10.1109/ECCE.2014.6954153
  • Filename
    6954153