DocumentCode :
1514187
Title :
Stochastic Modeling-Based Variability Analysis of On-Chip Interconnects
Author :
Vande Ginste, Dries ; De Zutter, Daniël ; Deschrijver, Dirk ; Dhaene, Tom ; Manfredi, Paolo ; Canavero, Flavio
Volume :
2
Issue :
7
fYear :
2012
fDate :
7/1/2012 12:00:00 AM
Firstpage :
1182
Lastpage :
1192
Abstract :
In this paper, a novel stochastic modeling strategy is constructed that allows assessment of the parameter variability effects induced by the manufacturing process of on-chip interconnects. The strategy adopts a three-step approach. First, a very accurate electromagnetic modeling technique yields the per unit length (p.u.l.) transmission line parameters of the on-chip interconnect structures. Second, parameterized macromodels of these p.u.l. parameters are constructed. Third, a stochastic Galerkin method is implemented to solve the pertinent stochastic telegrapher´s equations. The new methodology is illustrated with meaningful design examples, demonstrating its accuracy and efficiency. Improvements and advantages with respect to the state-of-the-art are clearly highlighted.
Keywords :
Galerkin method; integrated circuit interconnections; multiconductor transmission lines; stochastic processes; electromagnetic modeling technique; macromodels; on-chip interconnects; parameter variability effects assessment; stochastic Galerkin method; stochastic modeling-based variability analysis; stochastic telegrapher´s equations; transmission line parameters; Analytical models; Computational modeling; Moment methods; Numerical models; Polynomials; Stochastic processes; System-on-a-chip; Multiconductor transmission lines (MTLs); on-chip interconnects; stochastic Galerkin method (SGM); variability analysis;
fLanguage :
English
Journal_Title :
Components, Packaging and Manufacturing Technology, IEEE Transactions on
Publisher :
ieee
ISSN :
2156-3950
Type :
jour
DOI :
10.1109/TCPMT.2012.2192274
Filename :
6198290
Link To Document :
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