DocumentCode
1514187
Title
Stochastic Modeling-Based Variability Analysis of On-Chip Interconnects
Author
Vande Ginste, Dries ; De Zutter, Daniël ; Deschrijver, Dirk ; Dhaene, Tom ; Manfredi, Paolo ; Canavero, Flavio
Volume
2
Issue
7
fYear
2012
fDate
7/1/2012 12:00:00 AM
Firstpage
1182
Lastpage
1192
Abstract
In this paper, a novel stochastic modeling strategy is constructed that allows assessment of the parameter variability effects induced by the manufacturing process of on-chip interconnects. The strategy adopts a three-step approach. First, a very accurate electromagnetic modeling technique yields the per unit length (p.u.l.) transmission line parameters of the on-chip interconnect structures. Second, parameterized macromodels of these p.u.l. parameters are constructed. Third, a stochastic Galerkin method is implemented to solve the pertinent stochastic telegrapher´s equations. The new methodology is illustrated with meaningful design examples, demonstrating its accuracy and efficiency. Improvements and advantages with respect to the state-of-the-art are clearly highlighted.
Keywords
Galerkin method; integrated circuit interconnections; multiconductor transmission lines; stochastic processes; electromagnetic modeling technique; macromodels; on-chip interconnects; parameter variability effects assessment; stochastic Galerkin method; stochastic modeling-based variability analysis; stochastic telegrapher´s equations; transmission line parameters; Analytical models; Computational modeling; Moment methods; Numerical models; Polynomials; Stochastic processes; System-on-a-chip; Multiconductor transmission lines (MTLs); on-chip interconnects; stochastic Galerkin method (SGM); variability analysis;
fLanguage
English
Journal_Title
Components, Packaging and Manufacturing Technology, IEEE Transactions on
Publisher
ieee
ISSN
2156-3950
Type
jour
DOI
10.1109/TCPMT.2012.2192274
Filename
6198290
Link To Document