DocumentCode
1514215
Title
Doping characteristics of BF2+ implants in 〈100〉 and 〈111〉 silicon
Author
Drobny, Vladimir F. ; Rubalcava, Jade
Author_Institution
Texas Instrum., Tucson, AZ, USA
Volume
48
Issue
8
fYear
2001
fDate
8/1/2001 12:00:00 AM
Firstpage
1661
Lastpage
1666
Abstract
Significant differences were noticed between doping characteristics of BF2+ implanted (100) and (111) silicon. High dose BF2+ implants always produced higher sheet resistance (Rs) in (111) silicon. Compared to B +, the BF2+ implants exceeding the amorphization dose always resulted in higher Rs regardless of silicon orientation, Behavior was attributed to fluorine gettered at implant-induced defect sites. Sheet resistance of an F++B+ implanted layer was found to increase linearly with F+ dose. Residual fluorine content decreased with temperature, especially for (111) orientation, and coincided with a decrease in Rs. Effects of fluorine and crystal damage were separated experimentally and correlated to Rs of implanted layers. SIMS analysis revealed that fluorine segregated at two peaks in (111) silicon and four peaks in (100) silicon, Experimental results suggest that gettered fluorine and boron-fluorine bonds formed at heavily damaged crystal sites prevent boron from its full electrical activation in BF2+ implanted samples
Keywords
boron compounds; elemental semiconductors; getters; ion implantation; secondary ion mass spectroscopy; semiconductor doping; silicon; SIMS analysis; Si:BF2; amorphization dose; doping characteristics; electrical activation; gettering; heavily damaged crystal sites; implant-induced defect sites; sheet resistance; Annealing; Boron; Diffusion processes; Doping; Electric resistance; Implants; Ion implantation; Lattices; Silicon; Temperature;
fLanguage
English
Journal_Title
Electron Devices, IEEE Transactions on
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/16.936586
Filename
936586
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