• DocumentCode
    1514228
  • Title

    Device level modeling of metal-insulator-semiconductor interconnects

  • Author

    Gaofeng Wang ; Xiaoning Qi ; Zhiping Yu

  • Author_Institution
    Center for Integrated Syst., Stanford Univ., CA
  • Volume
    48
  • Issue
    8
  • fYear
    2001
  • fDate
    8/1/2001 12:00:00 AM
  • Firstpage
    1672
  • Lastpage
    1682
  • Abstract
    A rigorous model for metal-insulator-semiconductor (MIS) interconnects is presented based on device level simulation results. At the device level, the motion equations of charged carriers and Maxwell´s equations are simultaneously solved using a finite element scheme and Newton´s method. Simulations provide detailed information regarding field-carrier interactions, semiconductor substrate loss and nonlinearity, as well as the slow-wave effect, external bias effect, and screening effect of the charged carriers. An equivalent circuit model of MIS interconnects is established using an energy-based approach. The model consists of an equivalent transmission line that mimics the energy transport characteristics of the actual MIS interconnect, and provides a generalized nonlinear and electronic tunable circuit model suitable for both small-signal and large-signal analysis. Examples are presented to illustrate capabilities and efficiency of the method as well as properties of the equivalent circuit model
  • Keywords
    MIS devices; Maxwell equations; Newton method; equivalent circuits; finite element analysis; integrated circuit interconnections; integrated circuit modelling; losses; semiconductor device models; transmission line theory; MIS interconnects; Maxwell equations; Newton method; charged carriers; charged carriers screening effect; device level modeling; device level simulation; electronic tunable circuit model; energy transport characteristics; energy-based approach; equivalent circuit model; equivalent transmission line; external bias effect; field-carrier interactions; finite element scheme; generalized nonlinear circuit model; large-signal analysis; metal-insulator-semiconductor interconnects; motion equations; nonlinearity; semiconductor substrate loss; slow-wave effect; small-signal analysis; Circuit simulation; Distributed parameter circuits; Equivalent circuits; Finite element methods; Integrated circuit interconnections; Maxwell equations; Metal-insulator structures; Newton method; Nonlinear equations; Substrates;
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/16.936590
  • Filename
    936590