• DocumentCode
    151430
  • Title

    Design consideration for contactless DC connector in high power density future 380 V DC distribution system

  • Author

    Hayashi, Yasuhiro ; Toyoda, Hajime ; Ise, Toshifumi ; Matsumoto, Akiyoshi

  • Author_Institution
    Grad. Sch. of Eng., Osaka Univ., Suita, Japan
  • fYear
    2014
  • fDate
    14-18 Sept. 2014
  • Firstpage
    5690
  • Lastpage
    5697
  • Abstract
    Design consideration for the contactless DC connector has been conducted for future high power density 380 V DC distribution system. The power density barrier of 1.2 kW 384 V-192 V inductively-coupled connector based on the LLC resonant converter topology using GaN transistors has been evaluated taking the influences of the circuit configurations, parameters related to the transformer and the semiconductor power devices into account. The LLC topology with full-bridge rectifier using GaN transistors and Si-SBDs have the potential to realize higher power density connector compared with the configurations using center-tapped transformer and the half-bridge rectifier with SiC-SBDs. A prototype of a 1.2 kW 384 V-192 V contactless connector using GaN-HEMTs and Si-SBDs has been fabricated, and the efficiency of over 96.0 % and the ideal power density of 5.0 W/cm3 have been confirmed experimentally under 500 kHz operation. Design consideration has also shown the potential to achieve higher power density of 10 W/cm3. The proposed connector contributes to realizing high power density DC distribution system, because functions for both the isolated DC-DC converter and the conventional connector are integrated in a single instrument.
  • Keywords
    DC-DC power convertors; III-V semiconductors; bridge circuits; electric connectors; elemental semiconductors; gallium compounds; high electron mobility transistors; network topology; power distribution; rectifiers; resonant power convertors; silicon; silicon compounds; transformers; wide band gap semiconductors; DC distribution system; GaN; HEMT; LLC resonant converter topology; SBD; Si; SiC; center-tapped transformer; circuit configurations; contactless DC connector; contactless connector; frequency 500 kHz; full-bridge rectifier; half-bridge rectifier; high power density; higher power density connector; inductively-coupled connector; isolated DC-DC converter; power 1.2 kW; semiconductor power devices; transistors; voltage 384 V to 192 V; Connectors; Contacts; Density measurement; Power system measurements; RLC circuits; Rectifiers; Topology;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Energy Conversion Congress and Exposition (ECCE), 2014 IEEE
  • Conference_Location
    Pittsburgh, PA
  • Type

    conf

  • DOI
    10.1109/ECCE.2014.6954181
  • Filename
    6954181