DocumentCode
1514343
Title
Suppression of boron transient-enhanced diffusion in SiGe HBTs by a buried carbon layer
Author
Jouan, Sébastien ; Baudry, Hélène ; Ditartre, D. ; Fellous, Cyril ; Laurens, Michel ; Lenoble, Damien ; Marty, Michel ; Monroy, Augustin ; Perrotin, André ; Ribot, Pascal ; Vincent, Gilbert ; Chantre, Alain
Author_Institution
France Telecom R&D, Meylan, France
Volume
48
Issue
8
fYear
2001
fDate
8/1/2001 12:00:00 AM
Firstpage
1765
Lastpage
1769
Abstract
The experiments described in this paper show that base broadening effects due to extrinsic base implantation in SiGe HBTs can be suppressed by introducing a buried carbon layer under the SiGe/Si base prior to epitaxy. They also demonstrate that SiGe HBTs with excellent static (β×VAF~104 V) and dynamic (fTB×BVCEO~200 GHz×V) characteristics can be fabricated using an epitaxially aligned in-situ-doped polysilicon emitter and an appropriately designed SiGe/Si base profile
Keywords
Ge-Si alloys; characteristics measurement; diffusion; heterojunction bipolar transistors; ion implantation; semiconductor device measurement; semiconductor materials; HBTs; SiGe-Si; base broadening effects; base profile; buried carbon layer; dynamic characteristics; epitaxially aligned in-situ-doped polysilicon emitter; extrinsic base implantation; static characteristics; transient-enhanced diffusion; Annealing; Atomic layer deposition; Boron; Carbon dioxide; Cutoff frequency; Electron traps; Epitaxial growth; Germanium silicon alloys; Heterojunction bipolar transistors; Silicon germanium;
fLanguage
English
Journal_Title
Electron Devices, IEEE Transactions on
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/16.936705
Filename
936705
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