DocumentCode
151439
Title
A high voltage gain multilevel modular switched-capacitor DC-DC converter
Author
Dong Cao ; Wei Qian ; Peng, Fang Zheng
Author_Institution
Electr. & Comput. Eng. Dept., North Dakota State Univ., Fargo, ND, USA
fYear
2014
fDate
14-18 Sept. 2014
Firstpage
5749
Lastpage
5756
Abstract
This paper presents a multilevel modular switched-capacitor dc-dc converter for high voltage gain and high power application with reduced component rating and count. For the traditional switched-capacitor dc-dc converters in high voltage gain application, the switching device or the capacitor has to suffer the high voltage stress. For the topology with reduced device and capacitor voltage stress, a large amount of device and capacitor number is usually required. The proposed circuit has low device number, low device and capacitor voltage stress and low device current stress in contrast to the conventional circuits. Besides, the proposed circuit also has modular structure, low conduction loss, high frequency operation capability, interleaving operation capability and soft-switching features. Therefore, a high power density, high power, and high voltage gain converter can be built with the proposed circuit. Simulation results will be provided to validate the operating principle and features of the circuit.
Keywords
DC-DC power convertors; capacitor switching; high-voltage techniques; losses; zero current switching; zero voltage switching; capacitor voltage stress reduction; component count reduction; component rating reduction; high frequency operation capability; high power application; high power density; high voltage gain application; interleaving operation capability; low conduction loss; low device number; modular structure; multilevel modular switched-capacitor DC-DC converter; soft-switching features; switching device current stress; Capacitance; Capacitors; DC-DC power converters; Equivalent circuits; Stress; Switches; Switching circuits;
fLanguage
English
Publisher
ieee
Conference_Titel
Energy Conversion Congress and Exposition (ECCE), 2014 IEEE
Conference_Location
Pittsburgh, PA
Type
conf
DOI
10.1109/ECCE.2014.6954190
Filename
6954190
Link To Document