• DocumentCode
    1514991
  • Title

    Electrostatically Confined Plasma in Segmented Hollow Cathode Geometries for Surface Engineering

  • Author

    Gallo, Santiago Corujeira ; Crespi, Ângela E. ; Cemin, Felipe ; Figueroa, Carlos A. ; Baumvol, Israel J R

  • Author_Institution
    Plasmar Tecnol., Caxias do Sul, Brazil
  • Volume
    39
  • Issue
    11
  • fYear
    2011
  • Firstpage
    3028
  • Lastpage
    3032
  • Abstract
    A segmented hollow cathode (SHC) geometry was used for electrostatic confinement of plasma, and surface engineering treatments were conducted in this arrangement. The assessed processes included plasma nitriding, reactive deposition of sputtered material, and deposition of carbonaceous films by plasma-enhanced chemical vapor deposition with a bipolar pulsed-dc power supply on steel substrates. The treated specimens exhibited uniform surface morphology and deposition layers. Characterization techniques included optical microscopy, scanning electron microscopy with energy dispersive X-ray capability, and X-ray diffraction. The advantages and potential applications of the SHC arrangement are discussed in view of these results.
  • Keywords
    X-ray chemical analysis; X-ray diffraction; optical microscopy; plasma deposition; plasma inertial confinement; scanning electron microscopy; sputter deposition; surface hardening; surface morphology; X-ray diffraction; bipolar pulsed-dc power supply; carbonaceous films; electrostatically confined plasma; energy dispersive X-ray capability; optical microscopy; plasma nitriding; plasma-enhanced chemical vapor deposition; scanning electron microscopy; segmented hollow cathode geometry; sputtered material; surface engineering; surface morphology; Coatings; Geometry; Materials; Plasmas; Steel; Surface morphology; Surface treatment; Plasma confinement; plasma materials processing; steel; surface treatment;
  • fLanguage
    English
  • Journal_Title
    Plasma Science, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0093-3813
  • Type

    jour

  • DOI
    10.1109/TPS.2011.2141690
  • Filename
    5766042