Impact of Shorting Vias Placement on Embedded Planar Electromagnetic BandGap Structures Within Multilayer Printed Circuit Boards

Author

De Paulis, Francesco ; Raimondo, Leo ; Orlandi, Antonio

Author_Institution

Dept. of Electr. Eng., Univ. of L´´Aquila, L´´Aquila, Italy

Volume

58

Issue

7

fYear

2010

fDate

7/1/2010 12:00:00 AM

Firstpage

1867

Lastpage

1876

Abstract

This paper investigates the power integrity behavior of planar electromagnetic bandgap (EBG) structures embedded between two solid layers within the stack-up of a multilayer printed circuit board. The bandgap generation and power integrity performance of the embedded EBG can be achieved only by placing vias shorting the solid planes above and below the patterned layer. The vias inhibit the resonances of the cavity made by the two solid planes, ensuring the designed bandgap, as if the planar EBG was laid out on an outer stack-up layer. The impact of the stitching vias´ number and location is addressed and the concepts of regular, global, random, or local via placement are introduced.

Keywords

embedded systems; photonic band gap; printed circuits; embedded EBG structure; embedded planar electromagnetic bandgap structures; local via placement; multilayer printed circuit boards; patterned layer; power integrity performance; shorting vias placement; solid layers; solid planes; stack-up layer; Electromagnetic bandgap (EBG); embedded EBG; power integrity; via placement;

fLanguage

English

Journal_Title

Microwave Theory and Techniques, IEEE Transactions on

Publisher

ieee

ISSN

0018-9480

Type

jour

DOI

10.1109/TMTT.2010.2050029

Filename

5484448