Title :
Mid-frequency delta-I noise analysis of complex computer system boards with multiprocessor modules and verification by measurements
Author :
Garben, Bernd ; McAllister, Michael F. ; Becker, Wiren D. ; Frech, Roland
Author_Institution :
IBM Deutschland, Poughkeepsie, NY, USA
fDate :
8/1/2001 12:00:00 AM
Abstract :
This paper describes an efficient methodology for mid-frequency delta-I noise analysis of the power distribution network of a computer system. The method allows fast and accurate power noise simulations with SPEED97 on highly complex packaging structures. Simulation results for the mid-frequency power noise amplitudes on module and board planes and dependencies on decoupling capacitor parameters are presented. The package model used for the simulations allow the identification of the dominant resonant oscillations on the power distribution system following a delta-I step and yield the time response of the on-chip, on-module and on-board decoupling capacitors. The simulation results have been confirmed by measurements within 5%
Keywords :
capacitors; circuit noise; modules; packaging; power supply circuits; printed circuit layout; printed circuit testing; SPEED97; board planes; complex computer system boards; decoupling capacitor parameters; dominant resonant oscillations; mid-frequency delta-I noise analysis; multiprocessor modules; on-board decoupling capacitors; packaging structures; power distribution network; power noise simulations; time response; Capacitors; Computational modeling; Computer networks; Distributed computing; Noise level; Packaging; Power distribution; Power system modeling; Power systems; Resonance;
Journal_Title :
Advanced Packaging, IEEE Transactions on
DOI :
10.1109/6040.938296