Title :
Modeling of field penetration through planes in multilayered packages
Author :
Mao, Jifeng ; Srinivasan, Jegannathan ; Choi, Jinseong ; Swaminathan, Madhavan ; Do, Nhon
Author_Institution :
Dept. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
fDate :
8/1/2001 12:00:00 AM
Abstract :
This paper describes a method for analyzing the field penetrating through planes in package power distribution networks. This field can cause excessive noise in the system at resonant frequencies of the package. The effect has been quantified both in the time and frequency domain and compared with measurements. General guidelines have been suggested to suppress this noise by varying the material and physical parameters of the planes
Keywords :
electromagnetic field theory; integrated circuit modelling; integrated circuit noise; integrated circuit packaging; interference suppression; power supply circuits; coupled noise; field penetration; modeling; multilayered packages; noise suppression; package power distribution networks; package resonant frequencies; Circuit noise; Conductors; Electronics packaging; Frequency; Integrated circuit noise; Power supplies; Power system modeling; Power system transients; Power systems; Semiconductor device noise;
Journal_Title :
Advanced Packaging, IEEE Transactions on
DOI :
10.1109/6040.938300
