DocumentCode :
1515998
Title :
Foreword
Author :
Troster, G. ; Scheffler, Marc
Author_Institution :
ETH Zurich
Volume :
24
Issue :
3
fYear :
2001
Firstpage :
364
Lastpage :
365
Keywords :
Application software; Electronics packaging; Energy consumption; Europe; Helium; Implants; Integrated circuit packaging; Optical interconnections; Performance loss; Pervasive computing;
fLanguage :
English
Journal_Title :
Advanced Packaging, IEEE Transactions on
Publisher :
ieee
ISSN :
1521-3323
Type :
jour
DOI :
10.1109/TADVP.2001.938304
Filename :
938304
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=1515998
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