DocumentCode
1516361
Title
Environmental Influence on Sn Whisker Growth
Author
Dimitrovska, Aleksandra ; Kovacevic, Radovan
Author_Institution
Res. Center for Adv. Manuf., Southern Methodist Univ., Dallas, TX, USA
Volume
33
Issue
3
fYear
2010
fDate
7/1/2010 12:00:00 AM
Firstpage
193
Lastpage
197
Abstract
This paper considers the influence of 1) humidity and 2) acidic humidity on the growth of Sn whiskers. Sn whisker morphology was observed over a six-month period. The results show that the electroplated surfaces exposed to pure humidity are populated with Sn whiskers dimensionally smaller than surfaces exposed to acidic humidity. Variables analyzed include surface condition, Cu-Sn inter-metallic formation at the film/substrate interface by X-ray Diffraction (XRD), and film thickness.
Keywords
X-ray diffraction; electroplating; humidity; tin; whiskers (crystal); Sn; X-ray diffraction; XRD; acidic humidity; electroplated surfaces; film thickness; whisker growth; whisker morphology; Coatings; Compressive stress; Electronic components; Grain boundaries; Humidity; Manufacturing; Surface morphology; Tin; X-ray diffraction; X-ray scattering; ${hbox {Cu}}_{6}{hbox {Sn}}_{5}$ intermetallic compounds (IMCs); Sn electroplating; Sn whisker growth; X-ray Diffraction (XRD); oxidation;
fLanguage
English
Journal_Title
Electronics Packaging Manufacturing, IEEE Transactions on
Publisher
ieee
ISSN
1521-334X
Type
jour
DOI
10.1109/TEPM.2010.2048034
Filename
5484694
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