DocumentCode :
1516611
Title :
Packages go vertical
Author :
Goldstein, Harry
Volume :
38
Issue :
8
fYear :
2001
fDate :
8/1/2001 12:00:00 AM
Firstpage :
46
Lastpage :
51
Abstract :
Stacking different chips in a package tucks a complete system into implantable devices like hearing aids. In this paper, the author describes how cell phones and wearable computers could be next
Keywords :
cellular radio; hearing aids; integrated circuit packaging; portable computers; cell phones; chip stacking; hearing aids; implantable devices; integrated circuits; vertical packaging; wearable computers; Cellular phones; Chip scale packaging; Hearing aids; Integrated circuit interconnections; Packaging machines; Power system interconnection; Stacking; System-on-a-chip; Wearable computers; Wireless communication;
fLanguage :
English
Journal_Title :
Spectrum, IEEE
Publisher :
ieee
ISSN :
0018-9235
Type :
jour
DOI :
10.1109/6.938714
Filename :
938714
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=1516611
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