Title :
Effects of Acid Electrolytes and Electropolishing Conditions on Laser-Stencil Printing Performance
Author :
Lee, Yong-Won ; Kim, Keun-Soo ; Suganuma, Katsuaki
Author_Institution :
Manuf. Technol. Center, Samsung Electron. Co., Ltd., Suwon, South Korea
fDate :
5/1/2011 12:00:00 AM
Abstract :
The electropolishing process has shown promising results for improving the surface finish of small apertures in laser-stencils. We report on the results of the investigations of the parameters that control the electropolishing process using highly concentrated phosphoric acid. The effect of the phosphoric acid solution on the finish of the polished small apertures and the effect of the electropolishing time were investigated. An optimized process was established through inspection of the polished stencil apertures of the laser-stencil. The results demonstrated that the acid solution for the electrolyte as well as the electropolishing time had a significant effect on the small stencil´s aperture quality and the solder paste´s stencil-printing performance. In particular, a 95 wt.% phosphoric acid-based electrolyte showed encouraging results in terms of surface smoothness, improved solder-paste printing, and surface-mount-technology yields. The most effective electropolishing times were 5, 10, and 20 s for stencils thicknesses of 0.05, 0.08, and 0.10 mm, respectively.
Keywords :
electrolytes; electrolytic polishing; laser materials processing; printing; surface mount technology; acid electrolytes; electropolishing conditions; electropolishing time; highly concentrated phosphoric acid; laser-stencil printing performance; phosphoric acid solution; phosphoric acid-based electrolyte; polished stencil apertures; solder paste stencil-printing performance; solder-paste printing; surface smoothness; surface-mount technology; Apertures; Fabrication; Laser beam cutting; Printing; Surface emitting lasers; Surface treatment; Assembly; laser beam cutting; soldering; surface-mount technology;
Journal_Title :
Components, Packaging and Manufacturing Technology, IEEE Transactions on
DOI :
10.1109/TCPMT.2011.2104359