• DocumentCode
    1517854
  • Title

    Global modeling of microwave applications by combining the FDTD method and a general semiconductor device and circuit simulator

  • Author

    Witzig, Andreas ; Schuster, Christian ; Regli, Peter ; Fichtner, Wolfgang

  • Author_Institution
    Dept. of Electr. Eng., Swiss Federal Inst. of Technol., Zurich, Switzerland
  • Volume
    47
  • Issue
    6
  • fYear
    1999
  • fDate
    6/1/1999 12:00:00 AM
  • Firstpage
    919
  • Lastpage
    928
  • Abstract
    This paper presents the coupling of two commercially available simulation codes: DESSIS-ISE, a multidimensional semiconductor device and circuit simulator, and EMLAB-ISE, an electromagnetic-field solver based on the finite-difference time-domain (FDTD) method. Full-wave electromagnetics and nonlinear devices are simulated in a coupled self-consistent way using the lumped-element approach. The active region of the device is represented as a lumped element within the FDTD grid, while the packaging and waveguiding structures are modeled in their physical dimensions. For the nonlinear device, multidimensional semiconductor device simulation, as well as standard SPICE models, may be applied. Several examples show the capability of comprehensive analysis of microwave applications and the versatility in the simulation of the active elements. The coupling formalism is explained in detail, including time-step adjustment and biasing of active devices
  • Keywords
    SPICE; circuit simulation; finite difference time-domain analysis; microwave circuits; semiconductor device models; DESSIS-ISE; EMLAB-ISE; FDTD method; circuit simulator; coupled self-consistent method; finite-difference time-domain method; full-wave electromagnetics; global modeling; lumped-element approach; multidimensional semiconductor device simulator; standard SPICE models; time-step adjustment; waveguiding structures; Circuit simulation; Coupling circuits; Electromagnetic coupling; Electromagnetic devices; Finite difference methods; Microwave devices; Multidimensional systems; Semiconductor device packaging; Semiconductor devices; Time domain analysis;
  • fLanguage
    English
  • Journal_Title
    Microwave Theory and Techniques, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9480
  • Type

    jour

  • DOI
    10.1109/22.769327
  • Filename
    769327