• DocumentCode
    1517857
  • Title

    Characterization of Contact Discharge Between Small-Capacitance Devices

  • Author

    Soda, Yutaka ; Oda, Tetsuji

  • Author_Institution
    Univ. of Tokyo, Tokyo, Japan
  • Volume
    48
  • Issue
    4
  • fYear
    2012
  • Firstpage
    1189
  • Lastpage
    1194
  • Abstract
    The giant-magnetoresistive head suffers magnetic damage from electrostatic discharge (ESD) current on the order of 10 mA and thermal damage from ESD energy on the order of 0.5 nJ. The discharge between 2-pF capacitors at 10 V gave a peak current of 34 mA, and the discharge between 100-pF capacitors at 100 V reached 1.5 A. The peak current arose on the order of picofarads and was approximately maximized at the same value of both capacitors. Theoretical energy loss was estimated by the difference between the potential energies prior to and following the discharges. The energy loss was 0.05 nJ for 2-pF capacitors at 10 V and increased in excess of 0.5 nJ for greater than 20-pF capacitors. Therefore, the discharge between picofarad capacitances tends to cause the magnetic damage, and increasing the capacitance causes the thermal damage. Comparison of the potential energy loss and the current energy derived that the contact resistance varied from more than 200 to few ohms as the voltage and the energy loss increased.
  • Keywords
    capacitance; contact resistance; electrostatic discharge; ESD energy; capacitors; contact discharge characterization; contact resistance; electrostatic discharge current; energy loss; giant magnetoresistive head; magnetic damage; peak current; picofarad capacitance; small capacitance device; thermal damage; Capacitance; Capacitors; Contact resistance; Discharges; Electrostatic discharges; Fault location; Contact discharge; contact resistance; electrostatic discharge (ESD); energy loss; magnetic damage; magnetic head; peak current; thermal damage;
  • fLanguage
    English
  • Journal_Title
    Industry Applications, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0093-9994
  • Type

    jour

  • DOI
    10.1109/TIA.2012.2199954
  • Filename
    6200850