• DocumentCode
    1518608
  • Title

    PreFPIX2: core architecture and results

  • Author

    Hoff, James R. ; Mekkaoui, Abder ; Christian, David C. ; Zimmerman, Sergio ; Cancelo, Gustavo ; Kasper, Penny ; Yarema, Ray

  • Author_Institution
    Fermi Nat. Accel. Lab., Batavia, IL, USA
  • Volume
    48
  • Issue
    3
  • fYear
    2001
  • fDate
    6/1/2001 12:00:00 AM
  • Firstpage
    485
  • Lastpage
    492
  • Abstract
    PFIX is a pixel architecture designed for colliding-beam experiments at the Tevatron. Its most important application to date is the BTeV experiment. PreFPIX2 is a chip designed to test the FPIX Core, i.e., the pixel control and readout architecture. This FPIX Core will be mated to a periphery specific to a particular experiment. Earlier plans called for the BTeV FPIX chip to be designed in a rad-hard process. However, deep-submicron CMOS processes have demonstrated appropriate radiation tolerance at a lower cost and with greater reliability. Therefore, PreFPIX2 has been fabricated in a 0.25 micrometer process utilizing radiation tolerant design techniques. The architecture has undergone substantial development from earlier versions of FPIX. Most notable are the improvements to the column token passing scheme and to the end-of-column logic. Extensive simulations were performed using both SPICE and structural-level Verilog. Monte Carlo physics simulations of the BTeV pixel detector at half, full and double the planned luminosity were converted to Verilog compatible input files for the chip simulations, allowing the designers to observe the chip operating under real conditions and for extended periods of time. Analyzes of the results reveal that at all luminosities the FPIX Core correctly identifies better than 99.6% of input hits. Bench tests of fabricated chips confirm the accuracy of the simulations
  • Keywords
    CMOS digital integrated circuits; high energy physics instrumentation computing; microprocessor chips; BTeV experiment; CMOS; FPIX Core; PreFPIX2; SPICE; Verilog; chip; column token passing scheme; core architecture; end-of-column logic; pixel architecture; CMOS process; Costs; Detectors; Hardware design languages; Logic; Monte Carlo methods; Physics; Radiation hardening; SPICE; Testing;
  • fLanguage
    English
  • Journal_Title
    Nuclear Science, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9499
  • Type

    jour

  • DOI
    10.1109/23.940104
  • Filename
    940104