DocumentCode :
1518647
Title :
Accurate measurement of ground-ring inductance in ball grid array package
Author :
Horng, Tzyy-Sheng ; Wu, Sung-Mao
Author_Institution :
Inst. of Electr. Eng., Nat. Sun Yat-Sen Univ., Kaohsiung, Taiwan
Volume :
35
Issue :
7
fYear :
1999
fDate :
4/1/1999 12:00:00 AM
Firstpage :
520
Lastpage :
521
Abstract :
A new technique has been developed to measure the ground-ring inductance in a ball grid array (BGA) package. A simple parallel LC circuit is used to model the ground-ring parasitics at frequencies up to 1 GHz. After connecting an SMA connector to the ground ring of the BGA package, a network analyser can be used to measure the reflection coefficient (S11) up to 1 GHz from which the ground-ring inductance can be extracted. It has been found that the ground-ring inductance depends very strongly on the phase of S11. This leads to the advantage of excellent accuracy for the extracted quantities. The experimental ground-ring inductance data for a variety of BGA packages are verified by Ansoft simulation results
Keywords :
ball grid arrays; electric connectors; inductance measurement; integrated circuit measurement; integrated circuit packaging; network analysers; 0 to 1 GHz; Ansoft simulation results; SMA connector; ball grid array package; ground-ring inductance; ground-ring parasitics; network analyser; parallel LC circuit; reflection coefficient;
fLanguage :
English
Journal_Title :
Electronics Letters
Publisher :
iet
ISSN :
0013-5194
Type :
jour
DOI :
10.1049/el:19990408
Filename :
769455
Link To Document :
بازگشت