DocumentCode :
1519116
Title :
Extracting the electromechanical coupling constant of piezoelectric thin film by the high-tone bulk acoustic resonator technique
Author :
Zhou, Chong ; Pang, Wei ; Li, Qiang ; Yu, Hongyu ; Hu, Xiaotang ; Zhang, Hao
Author_Institution :
State Key Lab. of Precision Meas. Technol. & Instrum., Tianjin Univ., Tianjin, China
Volume :
59
Issue :
5
fYear :
2012
fDate :
5/1/2012 12:00:00 AM
Firstpage :
958
Lastpage :
962
Abstract :
In this paper, a new approach is proposed to rapidly and accurately measure the electromechanical coupling constant Kt2 of thin film piezoelectric material, which is critically important for real-time quality control of the piezoelectric film growth in mass production. An ideal lossy bulk acoustic resonator (LBAR) model is introduced and the theory behind the method is presented. A high-tone bulk acoustic resonator (HBAR) was fabricated on a silicon wafer. The impedance response of the resonator was measured, from which the Kt2 of the piezoelectric material was extracted. To illustrate the potential of the proposed technique to extract material properties, two HBAR devices employing AlN as the piezoelectric material were fabricated using an RF sputter system with known good and bad deposition conditions; the extracted Kt2 values of the piezoelectric material are compared.
Keywords :
III-V semiconductors; acoustic resonators; bulk acoustic wave devices; piezoelectric semiconductors; piezoelectric thin films; piezoelectricity; semiconductor growth; semiconductor thin films; sputter deposition; wide band gap semiconductors; AlN; RF sputter system; Si; deposition conditions; electromechanical coupling constant; high-tone bulk acoustic resonator devices; high-tone bulk acoustic resonator technique; lossy bulk acoustic resonator model; mass production; material properties; piezoelectric film growth; quality control; resonator impedance response; silicon wafer; thin film piezoelectric material; Acoustic waves; Electrodes; Impedance; Piezoelectric materials; Resonant frequency; Substrates;
fLanguage :
English
Journal_Title :
Ultrasonics, Ferroelectrics, and Frequency Control, IEEE Transactions on
Publisher :
ieee
ISSN :
0885-3010
Type :
jour
DOI :
10.1109/TUFFC.2012.2280
Filename :
6202419
Link To Document :
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