Title :
Passive alignment of single-mode fibers to integrated polymer waveguide structures utilizing a single-mask process
Author :
Moosburger, R. ; Hauffe, R. ; Siebel, U. ; Arndt, D. ; Kropp, J. ; Petermann, K.
Author_Institution :
Fachgebiet Hochfrequenztech., Tech. Univ. Berlin, Germany
fDate :
7/1/1999 12:00:00 AM
Abstract :
A fabrication process for high precision passive fiber chip coupling is presented. The difficulties of structuring highly nonplanar surfaces were solved by using an electrophoretic photoresist and introducing additional structures to prevent wide holes. The method involves only a single lithographic step for structuring the polymer waveguide and fiber aligning structures in Si and thereby minimizing the horizontal displacement. The loss due to fiber displacement is about 0.7 dB per front face.
Keywords :
integrated optics; optical couplers; optical fabrication; optical fibre couplers; photolithography; 0.7 dB; Si; additional structures; electrophoretic photoresist; fabrication process; fiber aligning structures; fiber displacement; high precision passive fiber chip coupling; horizontal displacement; integrated polymer waveguide structures; passive alignment; polymer waveguide; single lithographic step; single-mask process; single-mode fiber coupling; structuring highly nonplanar surfaces; wide holes; Etching; Optical device fabrication; Optical devices; Optical fiber devices; Optical fibers; Optical polymers; Optical surface waves; Optical waveguides; Resists; Silicon;
Journal_Title :
Photonics Technology Letters, IEEE
