Title :
Three-dimensionally interconnected bidirectional optical backplane
Author :
Kim, Gicherl ; Chen, Ray T.
Author_Institution :
Dept. of Electr. & Comput. Eng., Texas Univ., Austin, TX, USA
fDate :
7/1/1999 12:00:00 AM
Abstract :
The concept of a three-dimensionally interconnected bidirectional optical backplane for a high performance system containing multichip module boards is introduced. The backplane reported here employs one-dimensional (1-D) and two-dimensional (2-D) vertical-cavity surface-emitting laser (VCSEL), and photodetector arrays as transceivers. By integrating VCSEL, lens, doubly multiplexed holographic gratings, and photodetector arrays, we have demonstrated this architecture while using the third dimension as the signal propagating direction. Packaging related issues such as misalignment, crosstalk, and signal-to-noise ratio are studied. The frequency response of our device shows a bandwidth of 2.5 THz. Eye diagrams for a single bus line up to 1.5 GHz are demonstrated with clear eyes. An aggregate bandwidth of 6 GHz is thus confirmed with 2/spl times/2 bus lines.
Keywords :
holographic gratings; lenses; multichip modules; optical backplanes; optical crosstalk; photodetectors; semiconductor laser arrays; surface emitting lasers; transceivers; 2.5 THz; 3D interconnected bidirectional optical backplane; 6 GHz; VCSEL; clear eyes; doubly multiplexed holographic gratings; eye diagrams; frequency response; lens; misalignment; multichip module boards; packaging related issues; photodetector arrays; signal propagating direction; signal-to-noise ratio; single bus line; third dimension; three-dimensionally interconnected bidirectional optical backplane; transceivers; vertical-cavity surface-emitting laser; Backplanes; Bandwidth; Holographic optical components; Holography; Multichip modules; Optical crosstalk; Optical interconnections; Photodetectors; Two dimensional displays; Vertical cavity surface emitting lasers;
Journal_Title :
Photonics Technology Letters, IEEE
