DocumentCode :
1520727
Title :
Ultralow-Power TFT With Gate Oxide Fabricated by Nitric Acid Oxidation Method
Author :
Matsumoto, Taketoshi ; Kubota, Yasushi ; Yamada, Mikihiro ; Tsuji, Hiroshi ; Shimatani, Takafumi ; Hirayama, Yasuhiro ; Terakawa, Sumio ; Imai, Shigeki ; Kobayashi, Hikaru
Author_Institution :
Liquid Crystal Display Group, Japan Sci. & Technol. Agency, Taki, Japan
Volume :
31
Issue :
8
fYear :
2010
Firstpage :
821
Lastpage :
823
Abstract :
We have fabricated a thin-film transistor (TFT) in which a gate oxide layer possesses a stack structure with an ultrathin interfacial SiO2 layer formed by the nitric acid oxidation of silicon (NAOS) method at room temperature and a 40 nm CVD SiO2 layer. The drain current-voltage characteristics show that TFT with NAOS interfacial layer can be operated at 3 V (the conventional operation voltage is 12-15 V), indicating that a vast decrease in TFT power consumption is possible. The threshold voltage becomes less than 1 V, and the short-channel effect can be avoided.
Keywords :
CVD coatings; low-power electronics; oxidation; semiconductor device manufacture; silicon compounds; thin film transistors; CVD layer; NAOS method; SiO2; drain current-voltage characteristics; gate oxide layer possesses; nitric acid oxidation of silicon method; power consumption; ultralow power TFT fabrication; ultrathin interfacial layer; Dielectric films; leakage currents; oxidation; thin-film transistor (TFT);
fLanguage :
English
Journal_Title :
Electron Device Letters, IEEE
Publisher :
ieee
ISSN :
0741-3106
Type :
jour
DOI :
10.1109/LED.2010.2050856
Filename :
5491087
Link To Document :
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