• DocumentCode
    1520814
  • Title

    Numerical Analysis of Forward-Current/Voltage Characteristics of Vertical GaN Schottky-Barrier Diodes and p-n Diodes on Free-Standing GaN Substrates

  • Author

    Mochizuki, Kazuhiro ; Mishima, Tomoyoshi ; Terano, Akihisa ; Kaneda, Naoki ; Ishigaki, Takashi ; Tsuchiya, Tomonobu

  • Author_Institution
    Central Res. Lab., Hitachi Ltd., Kokubunji, Japan
  • Volume
    58
  • Issue
    7
  • fYear
    2011
  • fDate
    7/1/2011 12:00:00 AM
  • Firstpage
    1979
  • Lastpage
    1985
  • Abstract
    Forward-current-density JF/forward-voltage VF characteristics of vertical gallium-nitride (GaN) Schottky-barrier diodes (SBDs) and p-n diodes on free-standing GaN substrates were computationally, as well as experimentally, investigated. Based on the thermionic emission model, electron-drift mobility μn was used as a parameter to fit the JF-VF characteristics of both reported and fabricated GaN SBDs. At 300 K, μn was fitted to be 600 cm2/V ·s when electron concentration n was 1 × 1016 cm-3 and 750 cm2/V ·s when n was 5 ×1015 cm-3. Accordingly, the theoretical μn-n curve for a carrier compensation ratio of 0.90 was applied in the case of n-GaN layers on GaN substrates. With respect to GaN p-n diodes, the reported JF -VF characteristics were successfully fitted with dislocation-mediated carrier lifetimes in the high-injection region and with Shockley-Read-Hall lifetimes in the generation-recombination current region.
  • Keywords
    III-V semiconductors; Schottky barriers; Schottky diodes; carrier lifetime; gallium compounds; numerical analysis; wide band gap semiconductors; GaN; Shockley-Read-Hall lifetimes; carrier compensation ratio; forward-current-voltage characteristics; free-standing GaN substrates; generation-recombination current region; high-injection region; numerical analysis; p-n diodes; temperature 300 K; thermionic emission model; vertical GaN Schottky-barrier diodes; Anodes; Current measurement; Gallium nitride; Gold; Schottky diodes; Substrates; Gallium compounds; power semiconductor devices; simulation;
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/TED.2011.2145380
  • Filename
    5771084