DocumentCode :
1521158
Title :
Modeling of lead-frame plastic CSPs for accurate prediction of their low-pass filter effects on RFICs
Author :
Horng, Tzyy-Sheng ; Wu, Sung-Mao ; Huang, Hui-Hsiang ; Chiu, Chi-Tsung ; Hung, Chih-Pin
Author_Institution :
Dept. of Electr. Eng., Nat. Sun Yat-Sen Univ., Kaohsiung, Taiwan
Volume :
49
Issue :
9
fYear :
2001
fDate :
9/1/2001 12:00:00 AM
Firstpage :
1538
Lastpage :
1545
Abstract :
This paper presents a direct extraction method to construct the electrical models of lead-frame plastic chip scale packages for RF integrated circuits (RFICs) from the measured S-parameters. To evaluate the package effects on the reciprocal passive components, the insertion and return losses for an on-chip 50-Ω microstrip line housed in a 32-pin bump chip carrier (BCC) package were analyzed based on the established package model. Excellent agreement with measurement has been found up to 15 GHz. When applied to the nonreciprocal active components, the gain variations for a heterojunction-bipolar-transistor array housed in an 8-pin BCC package have also been successfully predicted up to 22 GHz. Both cases have demonstrated that the package acts as a low-pass filter to cause a sharp cutoff for the RFIC components above a certain frequency
Keywords :
S-parameters; chip scale packaging; heterojunction bipolar transistors; low-pass filters; microstrip lines; plastic packaging; 15 to 22 GHz; RF integrated circuit; S-parameters; bump chip carrier package; electrical model; gain; heterojunction bipolar transistor array; insertion loss; lead-frame plastic chip scale package; low-pass filter; microstrip line; nonreciprocal active component; parameter extraction; reciprocal passive component; return loss; Chip scale packaging; Electric variables measurement; Integrated circuit measurements; Integrated circuit modeling; Integrated circuit packaging; Plastic integrated circuit packaging; Predictive models; Radio frequency; Radiofrequency integrated circuits; Semiconductor device measurement;
fLanguage :
English
Journal_Title :
Microwave Theory and Techniques, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9480
Type :
jour
DOI :
10.1109/22.942564
Filename :
942564
Link To Document :
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