Title :
Modeling of lead-frame plastic CSPs for accurate prediction of their low-pass filter effects on RFICs
Author :
Horng, Tzyy-Sheng ; Wu, Sung-Mao ; Huang, Hui-Hsiang ; Chiu, Chi-Tsung ; Hung, Chih-Pin
Author_Institution :
Dept. of Electr. Eng., Nat. Sun Yat-Sen Univ., Kaohsiung, Taiwan
fDate :
9/1/2001 12:00:00 AM
Abstract :
This paper presents a direct extraction method to construct the electrical models of lead-frame plastic chip scale packages for RF integrated circuits (RFICs) from the measured S-parameters. To evaluate the package effects on the reciprocal passive components, the insertion and return losses for an on-chip 50-Ω microstrip line housed in a 32-pin bump chip carrier (BCC) package were analyzed based on the established package model. Excellent agreement with measurement has been found up to 15 GHz. When applied to the nonreciprocal active components, the gain variations for a heterojunction-bipolar-transistor array housed in an 8-pin BCC package have also been successfully predicted up to 22 GHz. Both cases have demonstrated that the package acts as a low-pass filter to cause a sharp cutoff for the RFIC components above a certain frequency
Keywords :
S-parameters; chip scale packaging; heterojunction bipolar transistors; low-pass filters; microstrip lines; plastic packaging; 15 to 22 GHz; RF integrated circuit; S-parameters; bump chip carrier package; electrical model; gain; heterojunction bipolar transistor array; insertion loss; lead-frame plastic chip scale package; low-pass filter; microstrip line; nonreciprocal active component; parameter extraction; reciprocal passive component; return loss; Chip scale packaging; Electric variables measurement; Integrated circuit measurements; Integrated circuit modeling; Integrated circuit packaging; Plastic integrated circuit packaging; Predictive models; Radio frequency; Radiofrequency integrated circuits; Semiconductor device measurement;
Journal_Title :
Microwave Theory and Techniques, IEEE Transactions on
