Title :
Short-Reach Optical Interconnects Employing High-Density Parallel-Optical Modules
Author_Institution :
Furukawa Electr. Co. Ltd., Ichihara, Japan
Abstract :
This paper reviews the high-density parallel-optical modules for use in board-to-board application in optical interconnects and describes their application, mechanical sizes, electrical-pluggable interfaces, optical-pluggable interfaces, transmission performance, and power consumption. Since board-to-board optical interconnects require a high data rate per channel of at least 10 Gb/s/ch, a power consumption of not more than 10 mW/Gb/s/link, and high reliability based on massive volume requirement, the usage of 1-μm wavelength range using InGaAs high-efficient semiconductor devices is promising to meet these requirements.
Keywords :
III-V semiconductors; gallium arsenide; indium compounds; low-power electronics; optical cables; optical interconnections; telecommunication network reliability; InGaAs; board-to-board application; electrical-pluggable interface; high reliability; high-density parallel-optical module; high-efficient semiconductor devices; low power consumption; optical-pluggable interface; short-reach optical interconnection; Connectors; Energy consumption; Integrated optics; Optical films; Optical interconnections; Optical receivers; Optical transmitters; Optical waveguides; Transceivers; Vertical cavity surface emitting lasers; High-speed modulation; low power consumption; optical interconnections; vertical-cavity surface-emitting lasers (VCSELs);
Journal_Title :
Selected Topics in Quantum Electronics, IEEE Journal of
DOI :
10.1109/JSTQE.2010.2049344