DocumentCode :
1522059
Title :
Single-layer miniature broadband microstrip antenna using wirebonding technique
Author :
Dou, W. ; Chia, M.Y.W.
Author_Institution :
Centre for Wireless Commun., Nat. Univ. of Singapore, Singapore
Volume :
148
Issue :
3
fYear :
2001
fDate :
6/1/2001 12:00:00 AM
Firstpage :
199
Lastpage :
202
Abstract :
A wirebonding technique is presented for designing a single-layer miniature and broadband microstrip antenna on the basis of experiments. The technique most commonly applied in device assembly will support manufacturing and packaging of small antennas by avoiding via-holes. Consisting of three short-circuited elements fed by a parasitic wirebonding configuration, the antenna in a package format has the merits of wide impedance bandwidth, miniature structure, flexible matching and easy integration into RF front-end units. Its stable and broadside copolarised radiation patterns in the frequency range of 2.40-2.51 GHz are satisfactory for Bluetooth application
Keywords :
UHF antennas; antenna radiation patterns; lead bonding; microstrip antennas; packaging; 2.4 to 2.51 GHz; Bluetooth application; RF front-end units; broadband microstrip antenna; broadside copolarised radiation patterns; device assembly; flexible matching; packaging; parasitic wirebonding configuration; short-circuited elements; single-layer miniature antenna; small antennas; wide impedance bandwidth; wire bonding technique;
fLanguage :
English
Journal_Title :
Microwaves, Antennas and Propagation, IEE Proceedings
Publisher :
iet
ISSN :
1350-2417
Type :
jour
DOI :
10.1049/ip-map:20010494
Filename :
942847
Link To Document :
بازگشت