DocumentCode :
1522658
Title :
Study on a C-class solvent-free silicone impregnating varnish
Author :
Li, Qiangjun ; Zhong, Jinghe ; Li, Yong ; Wang, Kai ; Jiang, Qibin ; Chen, Hongsheng
Author_Institution :
Zhuzhou Times New Mater. Technol. Co., Ltd., Zhuzhou, China
Volume :
17
Issue :
3
fYear :
2010
fDate :
6/1/2010 12:00:00 AM
Firstpage :
785
Lastpage :
790
Abstract :
In this paper, a new class of C-grade solvent-free silicone impregnating varnish was prepared by synthesizing polysilicone oligomers bearing methyl and phenyl groups. These oligomers also contained vinyl and hydrogen siloxane components which, under the influence of heat and platinum catalysis, induced crosslinking of the impregnating varnish. The varnish without any solvents kept liquid and flowed easily at room temperature (RT) and was heated to cure to a rigid membrane at high temperature up to 473 K. The properties of the varnish before and after curing were depicted in details, and the mechanism for synthesis of the solvent-free silicone impregnating varnish was introduced. The solvent-free silicone impregnating varnish was used on the winding as dielectric shield for a motor or electric device by vacuum pressure impregnation (VPI) which is the most conventional method for impregnation of the winding for a motor. The silicone varnish, which contained no decomposable and physiologically problematic components, was of very low volatility suitable for VPI. The application technology and processing conditions of the silicone impregnating varnish were discussed in details and a simulant procedure and a practical sketch about the four steps involved in the VPI process employing the silicone impregnating varnish were illustrated.
Keywords :
Cable insulation; Curing; Dielectrics and electrical insulation; Hydrogen; Platinum; Pulse width modulation; Resins; Silicon on insulator technology; Temperature; Traction motors; Silicone resin, solvent-free impregnating varnish, application technology, VPI;
fLanguage :
English
Journal_Title :
Dielectrics and Electrical Insulation, IEEE Transactions on
Publisher :
ieee
ISSN :
1070-9878
Type :
jour
DOI :
10.1109/TDEI.2010.5492251
Filename :
5492251
Link To Document :
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