DocumentCode :
1522715
Title :
Thin-film silicon solar cells using an adhesive bonding technique
Author :
Takato, Hidetaka ; Shimokawa, Ryuichi
Author_Institution :
Nat. Inst. of Adv. Ind. Sci. & Technol., Ibaraki, Japan
Volume :
48
Issue :
9
fYear :
2001
fDate :
9/1/2001 12:00:00 AM
Firstpage :
2090
Lastpage :
2094
Abstract :
Thin-film silicon solar cells using an adhesive bonding technique have been investigated. Surface passivation effect due to the developed adhesive is observed and a very low surface recombination velocity is obtained. A 10-μm-thick single-crystalline silicon solar cell is fabricated by adhesive bonding of a near-Lambertian alumina ceramic substrate. Open circuit voltage of 602 mV and short circuit current of 25.8 mA/cm2 are obtained. Incident light is effectively confined by the adhesive bonding technique. The results obtained indicate that the adhesive bonding technique is suitable for realizing high-efficiency, low-cost, thin-film cell
Keywords :
adhesion; elemental semiconductors; passivation; semiconductor thin films; silicon; solar cells; surface recombination; 602 mV; Al2O3; Si; adhesive bonding; near-Lambertian alumina ceramic substrate; open circuit voltage; optical confinement; short circuit current; single crystalline silicon; surface passivation; surface recombination velocity; thin film solar cell; Bonding; Ceramics; Passivation; Photovoltaic cells; Semiconductor thin films; Short circuit currents; Silicon; Substrates; Thin film circuits; Voltage;
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/16.944200
Filename :
944200
Link To Document :
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