DocumentCode :
1522891
Title :
Low-frequency noise degradation caused by STI interface effects in SOI-MOSFETs
Author :
Lee, Hyeokjae ; Lee, Jong-Ho ; Shin, Hyungsoon ; Park, Young June ; Min, Hong Shick
Author_Institution :
Sch. of Electr. Eng. & Comput. Sci., Seoul Nat. Univ., South Korea
Volume :
22
Issue :
9
fYear :
2001
Firstpage :
449
Lastpage :
451
Abstract :
The low-frequency noise characteristics of SOI MOSFETs with shallow trench isolation (STI) structure are investigated for various device sizes with three different gate shapes. Devices with channel region butted to the STI show an increase of low-frequency noise as the channel width is reduced. In comparison, the devices without the STI butted to the channel region show much less increase of noise power spectral density with channel width. From the charge pumping and noise measurement results, the interface-state generated by the STI process is identified as the cause of these anomalous phenomena.
Keywords :
MOSFET; etching; interface states; isolation technology; semiconductor device noise; semiconductor device reliability; silicon-on-insulator; NMOSFET; SOI-MOSFETs; STI interface effects; channel region; channel width; charge pumping; etching process; gate shape; interface-state generation; low-frequency noise characteristics; low-frequency noise degradation; noise power spectral density; shallow trench isolation; Charge pumps; Degradation; Electric variables; Low-frequency noise; MOSFETs; Noise shaping; Shape; Silicon; Thermal stresses; Transconductance;
fLanguage :
English
Journal_Title :
Electron Device Letters, IEEE
Publisher :
ieee
ISSN :
0741-3106
Type :
jour
DOI :
10.1109/55.944336
Filename :
944336
Link To Document :
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