• DocumentCode
    1522978
  • Title

    Design and Characterization of a Multilevel DRAM

  • Author

    Koob, John C. ; Ung, Sue Ann ; Cockburn, Bruce F. ; Elliott, Duncan G.

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Univ. of Alberta in Edmonton, Edmonton, AB, Canada
  • Volume
    19
  • Issue
    9
  • fYear
    2011
  • Firstpage
    1583
  • Lastpage
    1596
  • Abstract
    Multilevel DRAM (MLDRAM) increases the storage density of DRAMs by using more than two signal levels in the data storage cells. Our MLDRAM uses reference and data cell signals that are generated in the cell array using charge sharing. The single-step sensing method uses multiple reference signals in parallel. We describe an operational 19200-cell MLDRAM test chip in 1.8-V, 180-nm mixed-signal CMOS that allows 1, 1.5, 2, 2.25, and 2.5 bits-per-cell operation using 2, 3, 4, 5, and 6 data signal levels, respectively. Characterization features include a partitioned memory array with four different data cell sizes, two sense amplifier sizes, and selective bitline shielding. New tests were developed using an MLDRAM fault model covering basic functionality, retention time, multilevel march, inter-bitline coupling and cell plate voltage bump tests. We show that, with short bitlines, MLDRAM´s noise margins can be similar to DRAM´s to more reliably store two bits in a 1T1C cell.
  • Keywords
    CMOS memory circuits; DRAM chips; integrated circuit design; integrated circuit testing; 1T1C cell; bitline shielding; cell array; cell plate voltage bump tests; charge sharing; data cell signals; data storage cells; dynamic random-access memory; inter-bitline coupling; mixed-signal CMOS; multilevel DRAM; multilevel march; multiple reference signals; partitioned memory array; retention time; sense amplifier sizes; single-step sensing method; size 180 nm; storage density; voltage 1.8 V; Circuit faults; Delay; Logic; Noise reduction; Packaging; Random access memory; Research and development; Signal generators; Testing; Voltage; Dynamic random-access memory (DRAM); multilevel cell; multiple-valued logic;
  • fLanguage
    English
  • Journal_Title
    Very Large Scale Integration (VLSI) Systems, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1063-8210
  • Type

    jour

  • DOI
    10.1109/TVLSI.2010.2051569
  • Filename
    5492301