Three-dimensional MMIC technology for low-cost millimeter-wave MMICs

Author

Nishikawa, Kenjiro ; Kamogawa, Kenji ; Piernas, Belinda ; Tokumitsu, Masami ; Sugitani, Suehiro ; Toyoda, Ichihiko ; Araki, Katsuhiko

Author_Institution

NTT Network Innovation Labs., Japan

Volume

36

Issue

9

fYear

2001

fDate

9/1/2001 12:00:00 AM

Firstpage

1351

Lastpage

1359

Abstract

This paper highlights the key advantages of the three-dimensional (3-D) MMIC technology in the millimeter-wave frequency band and describes recently developed compact 3-D MMICs on GaAs and Si substrates. The 3-D MMIC technology offers high integration levels, compactness, simple design procedures, and short fabrication turn-around time, resulting in millimeter-wave MMICs at greatly reduced cost. This paper also proposes a new methodology for MMIC development based on 3-D/multilayer MMIC technology that accelerates the cost reduction of millimeter-wave MMICs. The new technology achieves compact and highly integrated millimeter-wave MMICs that are extremely cost effective

Keywords

MIMIC; integrated circuit design; microstrip circuits; GaAs; Si; compactness; cost reduction; design procedures; fabrication turn-around time; integration levels; low-cost millimeter-wave MMICs; three-dimensional MMIC technology; Costs; Dielectric substrates; Fabrication; Gallium arsenide; Integrated circuit technology; MMICs; Millimeter wave integrated circuits; Millimeter wave radar; Millimeter wave technology; Nonhomogeneous media;

fLanguage

English

Journal_Title

Solid-State Circuits, IEEE Journal of

Publisher

ieee

ISSN

0018-9200

Type

jour

DOI

10.1109/4.944662

Filename

944662