Title :
A Generalized Multiple Scattering Method for Dense Vias With Axially Anisotropic Modes in an Arbitrarily Shaped Plate Pair
Author :
Zhang, Yao-Jiang ; Fan, Jun
Author_Institution :
Dept. of Electr. & Comput. Eng., Missouri Univ. of Sci. & Technol., Rolla, MO, USA
fDate :
7/1/2012 12:00:00 AM
Abstract :
Numerical addition theorems of both axially anisotropic and axially isotropic parallel-plate modes are derived using a method based on boundary integral equations. This leads to a generalized multiple scattering (GMS) method for signal/power integrity analysis of dense vias in an arbitrarily shaped plate pair, which overcomes the limitation of the conventional multiple scattering method depending on the analytical addition theorems in an infinitely large or a finite circular plate pair. Both the numerical addition theorems and the GMS method have been validated by comparing results with either analytical expressions for special cases or full-wave simulations for more general cases. Several examples are provided to demonstrate the advantages of the generalized method over previous via models by taking into account the axially anisotropic modes due to the asymmetry caused by dense vias and/or arbitrarily shaped power/ground plate edges on via performance.
Keywords :
boundary integral equations; electromagnetic wave scattering; numerical analysis; GMS method; analytical addition theorems; arbitrarily shaped plate pair; arbitrarily shaped power-ground plate edges; axially anisotropic modes; axially isotropic parallel-plate modes; boundary integral equations; dense vias; fínite circular plate pair; full-wave simulations; generalized multiple scattering method; infinitely large plate pair; numerical addition theorems; signal-power integrity analysis; via performance; Analytical models; Boundary conditions; Integral equations; Integrated circuit modeling; Mathematical model; Scattering; Vectors; Addition theorems; axially anisotropic modes; boundary integral equation method; generalized multiple scattering (GMS) method; signal/power integrity; via modeling;
Journal_Title :
Microwave Theory and Techniques, IEEE Transactions on
DOI :
10.1109/TMTT.2012.2195195