• DocumentCode
    1523336
  • Title

    Special issue of materials processing and reliability of 3D interconnects

  • Volume
    32
  • Issue
    6
  • fYear
    2011
  • fDate
    6/1/2011 12:00:00 AM
  • Firstpage
    827
  • Lastpage
    827
  • Abstract
    Prospective authors are requested to submit new, unpublished manuscripts for inclusion in the upcoming event described in this call for papers.
  • fLanguage
    English
  • Journal_Title
    Electron Device Letters, IEEE
  • Publisher
    ieee
  • ISSN
    0741-3106
  • Type

    jour

  • DOI
    10.1109/LED.2011.2156731
  • Filename
    5772141
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1523336