Title :
Buried double bondwires for microwave hermetic packages
Author :
Sung-Jin Kim ; Hai-young Lee
Author_Institution :
Sch. of Electr. & Electron. Eng., Ajou Univ., Suwon
fDate :
12/4/1997 12:00:00 AM
Abstract :
Double bondwires buried in dielectric material are proposed for high frequency hermetic packages and characterised experimentally and theoretically up to 30 GHz. These buried bondwires show a significant reduction in parasitic inductance (0.1 nH) and superior impedance matching to 50 Ω
Keywords :
MMIC; impedance matching; integrated circuit packaging; lead bonding; method of moments; 30 GHz; 50 ohm; MMIC; buried double bondwire; dielectric material; high frequency characteristics; impedance matching; method of moments; microwave hermetic package; parasitic inductance;
Journal_Title :
Electronics Letters
DOI :
10.1049/el:19971438
