DocumentCode
1523587
Title
Buried double bondwires for microwave hermetic packages
Author
Sung-Jin Kim ; Hai-young Lee
Author_Institution
Sch. of Electr. & Electron. Eng., Ajou Univ., Suwon
Volume
33
Issue
25
fYear
1997
fDate
12/4/1997 12:00:00 AM
Firstpage
2130
Lastpage
2132
Abstract
Double bondwires buried in dielectric material are proposed for high frequency hermetic packages and characterised experimentally and theoretically up to 30 GHz. These buried bondwires show a significant reduction in parasitic inductance (0.1 nH) and superior impedance matching to 50 Ω
Keywords
MMIC; impedance matching; integrated circuit packaging; lead bonding; method of moments; 30 GHz; 50 ohm; MMIC; buried double bondwire; dielectric material; high frequency characteristics; impedance matching; method of moments; microwave hermetic package; parasitic inductance;
fLanguage
English
Journal_Title
Electronics Letters
Publisher
iet
ISSN
0013-5194
Type
jour
DOI
10.1049/el:19971438
Filename
645745
Link To Document