Title :
Highly reliable plastic packaging for laser diode and photodiode modules used for access network
Author :
Fukuda, Motohisa ; Ichikawa, Fusao ; Yamada, Y. ; Inoue, Yasuyuki ; Kato, Kazuhiko ; Sato, Hikaru ; Sugie, Toshiharu ; Toba, H. ; Yoshida, J.
Author_Institution :
NTT Opto-Electron. Labs., Kanagawa
fDate :
12/4/1997 12:00:00 AM
Abstract :
The feasibility of plastic packaging for laser diode and photodiode modules is demonstrated from the viewpoint of reliability. The stable operation of these modules is confirmed under various long term aging tests, high humidity-high temperature tests (85°C, 85% RH) and temperature cycling tests (-40/+85°C). The plastic packaging for laser diode and photodiode modules is potentially suitable for low cost optical transmitters
Keywords :
ageing; environmental testing; integrated optoelectronics; modules; optical fibre networks; optical receivers; optical transmitters; photodiodes; plastic packaging; semiconductor device packaging; semiconductor device reliability; semiconductor lasers; stability; -40 to 85 C; LD modules; high humidity-high temperature tests; high reliability; laser diode modules; long term aging tests; low cost optical transmitters; photodiode modules; plastic packaging; stable operation; temperature cycling tests;
Journal_Title :
Electronics Letters
DOI :
10.1049/el:19971365
