• DocumentCode
    1523820
  • Title

    Monolithic integration of substrate input/output resonant photodetectors and vertical-cavity lasers

  • Author

    Sjölund, O. ; Louderback, D.A. ; Hegblom, E.R. ; Ko, J. ; Coldren, L.A.

  • Author_Institution
    Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA
  • Volume
    35
  • Issue
    7
  • fYear
    1999
  • fDate
    7/1/1999 12:00:00 AM
  • Firstpage
    1015
  • Lastpage
    1023
  • Abstract
    We present theoretical and experimental results on monolithically integrated through-the-substrate input/output vertical-cavity lasers (VCLs) and resonant photodetectors that are compatible with substrate-side micro optics and flip-chip bonding. The required difference in bottom mirror reflectivity between the VCL and the detector is achieved by selective oxidation of a few high Al-content AlGaAs layers in the bottom mirror for the VCL. The modeling shows that using this approach makes it possible to individually design VCLs and resonant detectors from the same epitaxial structure without compromising performance of either device. Furthermore, since the oxidized layers are placed far enough from the active region, the VCL design is very robust with respect to uncertainties in the oxidized layers. For the detectors, we expect about 60% quantum efficiency, a 6-nm full-width at half-maximum optical bandwidth, and less than 1 nm difference in operating wavelength from the VCLs. Experimentally, VCLs and adjacent detectors with integrated microlenses have a difference of less than 0.5 nm in operating wavelength. The detectors have responsivities of 0.48 A/W, corresponding to 60% quantum efficiency and 7-nm optical bandwidths. Single-mode VCL´s exhibit threshold currents as low as 135 μA while maintaining differential efficiencies above 50%. Larger multimode VCLs have differential efficiencies exceeding 70% with threshold currents of 0.5 mA
  • Keywords
    flip-chip devices; integrated optoelectronics; laser mirrors; micro-optics; photodetectors; reflectivity; substrates; surface emitting lasers; 0.5 mA; 60 percent; 70 percent; active region; adjacent detectors; bottom mirror; bottom mirror reflectivity; differential efficiencies; epitaxial structure; flip-chip bonding; full-width at half-maximum optical bandwidth; high Al-content AlGaAs layers; integrated microlenses; monolithic integration; monolithically integrated through-the-substrate input/output vertical-cavity lasers; operating wavelength; optical bandwidths; oxidized layers; quantum efficiency; resonant detectors; resonant photodetectors; responsivities; selective oxidation; substrate input/output resonant photodetectors; substrate-side micro optics; threshold currents; uncertainties; vertical-cavity lasers; Bandwidth; Detectors; Laser modes; Laser theory; Mirrors; Monolithic integrated circuits; Resonance; Substrates; Threshold current; Vertical cavity surface emitting lasers;
  • fLanguage
    English
  • Journal_Title
    Quantum Electronics, IEEE Journal of
  • Publisher
    ieee
  • ISSN
    0018-9197
  • Type

    jour

  • DOI
    10.1109/3.772170
  • Filename
    772170