• DocumentCode
    1523867
  • Title

    Development of a Heat Sink With Periodic Asymmetric Structures Using Grayscale Lithography and Deep Reactive Ion Etching

  • Author

    Thiagarajan, Naveenan ; Kapsenberg, Florian ; Narayanan, Vinod ; Bhavnani, Sushil H. ; Ellis, Charles D.

  • Author_Institution
    Dept. of Mech. Eng., Auburn Univ., Auburn, AL, USA
  • Volume
    33
  • Issue
    7
  • fYear
    2012
  • fDate
    7/1/2012 12:00:00 AM
  • Firstpage
    1054
  • Lastpage
    1056
  • Abstract
    This letter describes the fabrication and development of a novel heat sink for two-phase liquid cooling of electronics. The surface of the heat sink is asymmetric in the form of sawtooth ratchets with the long slope at an angle of 24° and is enhanced with reentrant cavities, which act as vapor trapping sites. The sawtooth ratchets were fabricated using grayscale lithography and deep reactive ion etching and the reentrant cavities using anisotropic etching. In pool boiling experiments with deionized water, surface asymmetry results in a net force imbalance acting on the vapor bubbles departing from the reentrant cavities, thereby resulting in bubbles departing at an angle with instantaneous velocities in excess of 600 mm/s. This novel surface developed demonstrates the ability to effect lateral motion of bubbles and the liquid in vicinity.
  • Keywords
    boiling; bubbles; cooling; heat sinks; microchannel flow; photolithography; sputter etching; two-phase flow; Si; anisotropic etching; bubbles lateral motion; deep reactive ion etching; deionized water; grayscale lithography; heat sink surface; liquid vicinity; net force imbalance; periodic asymmetric structures; pool boiling experiments; reentrant cavities; sawtooth ratchets; surface asymmetry; two-phase liquid cooling; vapor bubbles; vapor trapping sites; Cavity resonators; Etching; Heat sinks; Heating; Periodic structures; Silicon; Deep reactive ion etching (DRIE); electronics cooling; grayscale lithography; pool boiling; reentrant cavities;
  • fLanguage
    English
  • Journal_Title
    Electron Device Letters, IEEE
  • Publisher
    ieee
  • ISSN
    0741-3106
  • Type

    jour

  • DOI
    10.1109/LED.2012.2197670
  • Filename
    6204319