Abstract :
Advances by top-tier chip-makers in 300-mm wafer technology are picking up in speed. As technology, competition, and customer demands for ICs keep on growing and the cost of new 300-mm wafer fabrication facilities reaches US $2 billion to $3 billion, concern about environmental impact is counting for much more in business success. Use of 300-mm technology will push industry to exploit resources such as chemicals, energy, and water with greater efficiency and will lay even greater demands on the semiconductor designers in the areas of product, process, and equipment. Three areas with the potential for marked environmental improvement in the industry are isolation technology and mini-environments, perfluorinated compound reductions, and fusion barrier technology. These issues are discussed as well as product takeback, electromagnetic fields, CFCs and appliances, and design for the environment
Keywords :
environmental factors; isolation technology; semiconductor device manufacture; 300 mm; 300-mm wafer technology; CFCs; IC technology; chip-makers; design for the environment; electromagnetic fields; environmental impact; environmental improvement; fusion barrier technology; isolation technology; mini-environments; perfluorinated compound reductions; product takeback; semiconductor designers; Chemical industry; Chemical processes; Chemical products; Chemical technology; Costs; Demand forecasting; Fabrication; Isolation technology; Technology forecasting; Water resources;
